Power Electronics Process Analysis Engineer

This role is focused on manufacturing process performance, defect detection, and root cause analysis—not product design or electrical testing. Responsible for analyzing, improving, and validating soldering and welding processes in power electronics manufacturing through hands-on failure analysis, cross-sectioning techniques, and advanced inspection systems (AOI/AXI).

Key Responsibilities

• Perform hands-on cross-sectioning and solder/welding joint analysis to evaluate solder quality, identify defects (voids, cracks, insufficient wetting, etc.), and support root cause investigations.
• Operate and interpret results from AOI (Automated Optical Inspection) and AXI (X-ray Inspection) systems to detect and classify soldering defects in power electronics assemblies.
• Analyze welding & soldering processes (selective soldering, reflow, or similar) ensuring robust and repeatable manufacturing performance.
• Perform mechanical validation of solder joints, including pull/shear or tensile-type evaluations when applicable.
• Lead failure analysis activities using laboratory equipment (cutting, mounting, polishing, microscopy) to determine defect origin and drive corrective actions.
• Correlate inspection findings (AOI/AXI) with physical analysis (cross-sections, intermetallic evaluation) to validate defect mechanisms and process gaps.
• Support continuous improvement initiatives focused on defect reduction, yield improvement, and process stability.
• Work closely with manufacturing, quality, and supplier teams to ensure process alignment and defect containment.
• Define and standardize inspection criteria and acceptance thresholds for solder joints in power electronics products.

• Education: Bachelor’s degree in Engineering (Mechanical, Electrical, Manufacturing, Mechatronics, or related field).

• Required Qualifications

  • Strong hands-on experience with cross-sectioning and solder joint analysis, including intermetallic evaluation and void detection.
  • Proven experience using AOI and AXI inspection systems (defect detection, programming, interpretation of results).
  • Experience in failure analysis and root cause investigation in a manufacturing environment.
  • Hands-on experience with laboratory equipment for sample preparation, including:
    • Precision cutting tools
    • Diamond saws
    • Waterjet cutting
    • Wire EDM cutting
    • Mounting and polishing equipment
  • Experience performing or supporting mechanical testing of solder joints (pull, shear, or tensile methods).
  • Ability to define cutting and preparation methodologies for new product introductions (NPI). Experience working in production environments with a focus on quality and process improvement.

  Preferred Qualifications

  • Experience in high-reliability or automotive power electronics manufacturing.
  • Knowledge of IPC standards (e.g., IPC-A-610, IPC-7095).
  • Experience correlating process parameters with defect generation.
  • Exposure to continuous improvement methodologies (Six Sigma, etc.).

  Inspection & Process Expertise: 

  Demonstrated experience validating and analyzing soldering and welding processes using laboratory and inline inspection systems (AOI, AXI, CT inspection), including:

  • Vacuum Soldering
    • CT inspection and defect analysis
    • Solder wetting evaluation
    • Void detection and analysis
    • Bond line thickness control
    • Excess solder / solder bleed-out identification
  • Laser Welding
    • Destructive validation methods
    • Weld depth penetration analysis
    • Weld length verification
    • Weld inspection area definition and validation
  • Selective Soldering
    • Pin protrusion evaluation
    • Percentage of land area covered with wetted solder on secondary side (solder source side)
    • Wetting on solder source side of lead and barrel
    • Excess solder defects (solder balls)
    • Bridging defects
    • Solder webbing / splashes
    • Solder fracture / blow holes
    • Solder connection wetting angle evaluation
    • Non-wetting conditions
    • Solder volume control
    • Vertical fill validation

• Language Skills: Advanced proficiency in English (written and verbal) to support global reporting, technical documentation, and cross-functional collaboration.